For engineers, the takeaway is clear: The WCD9341 offers 130 dB dynamic range and native DSD support in a tiny 5x6 mm package—making it worth the effort to secure the datasheet via official channels. For audiophiles, understanding its pinout and power requirements explains why phones using this chip require high-impedance headphones (50Ω+) to unlock the "high-gain mode" described in Section 3.4 of the datasheet.
154-pin Wafer Level Chip Scale Package (WLCSP), designed for high-density mobile PCB layouts. wcd9341 datasheet
The WCD9341 was widely adopted in the premium smartphone market between 2017 and 2019. It was most notably found in devices utilizing the platform (e.g., Google Pixel 3, OnePlus 6, Samsung Galaxy S9/S9+ in certain regions) and the Snapdragon 855 platform. For engineers, the takeaway is clear: The WCD9341
: Inability to record voice memos, dead microphone in calls. The WCD9341 was widely adopted in the premium
: Powers ultra-low-power voice processing and supports simultaneous wake-word detection for voice assistants.
| Ball Range | Signal Group | Description | | :--- | :--- | :--- | | A1-A5, B1-B5 | | Microphone bias voltage (2.0V/2.5V/2.8V selectable). | | C3-C8, D3-D8 | HPH_L, HPH_R | High-fidelity headphone outputs (left/right). | | F1-F10 | VDD_IO | I2S (Inter-IC Sound) and I2C (Inter-Integrated Circuit) control buses. | | J5-J12 | VSS / GND | Analog and digital ground planes. Critical: Split planes are required. | | K1-K8 | SLIMbus | Qualcomm’s proprietary serial bus for audio data. |